App & Solution
![1559798929820486.jpg 半导体A 450.jpg](/public/ueditor/upload/image/20190606/1559798929820486.jpg)
Silicon nitride precise cutting
![1559798947905689.jpg 硅片730 B.jpg](/public/ueditor/upload/image/20190606/1559798947905689.jpg)
Silicon wafer drilling, cutting and blind slot making
![1559798960531829.jpg 半导体C 730.jpg](/public/ueditor/upload/image/20190606/1559798960531829.jpg)
Silicon carbide precise cutting
Semiconductor material precise cutting
DCT DirectLaser S or U series are ideal for cutting Silicon carbide (SiC), Silicon nitride (AlSiC), Aluminum silicon carbide (AlSiC), Gallium arsenide (GaAs) etc. They also can be used for making MEMS micro structure.