App & Solution
![1561000877552903.jpg PTFE 450.jpg](/public/ueditor/upload/image/20190620/1561000877552903.jpg)
Making conductive pattern on PTFE based materials and external cutouts
![1560998803461319.jpg PTFE 730.jpg](/public/ueditor/upload/image/20190620/1560998803461319.jpg)
Cutting PTFE with ultra-short pulse laser
![1560999344411612.jpg PTFE挖盲槽.jpg](/public/ueditor/upload/image/20190620/1560999344411612.jpg)
Making blind slot on PTFE
High precise PTFE processing
The DCT laser precision processing equipment has a vast amount of application experience on polytetrafluoroethylene (PTFE) based PCBs. It has a wide range of applications in direct forming of conductive patterns, complex external/internal cutouts, and process wire removal. With the increasing demand for buried passive components in PTFE substrates, the DCT DirectLaser S series devices are increasingly being used in the selective-depth-cutting processing for PTFE or other circuit board substrates.