App & Solution
![1559797426107011.jpg LCP A 450.jpg](/public/ueditor/upload/image/20190606/1559797426107011.jpg)
LCP selective-depth-cutting
![1559797436105858.jpg LCP 第二张 730.jpg](/public/ueditor/upload/image/20190606/1559797436105858.jpg)
Multilayer LCP cutting with ultra-short pulse laser
![1560999537617765.jpg LCP 第三张 730.jpg](/public/ueditor/upload/image/20190620/1560999537617765.jpg)
Structuring conductive pattern on LCP
Laser processing LCP materials
Thanks to the DCT´s unique graphic matching technology, the DCT ultra-short pulse laser equipment is widely used in mass production for multi-layer LCP carbonization-free full-cutting, and has a large amount of application experience in LCP selective-depth-cutting. In addition, making conductive patterns with laser directly on LCP substrates is gradually showing its unique advantages.