LCP A 450.jpg
LCP selective-depth-cutting
LCP 第二张 730.jpg
Multilayer LCP cutting with ultra-short pulse laser                       
LCP 第三张 730.jpg
Structuring conductive pattern on LCP

Laser processing LCP materials

Thanks to the DCT´s unique graphic matching technology, the DCT ultra-short pulse laser equipment is widely used in mass production for multi-layer LCP carbonization-free full-cutting, and has a large amount of application experience in LCP selective-depth-cutting. In addition, making conductive patterns with laser directly on LCP substrates is gradually showing its unique advantages.