The DirectLaser U Series is engineered for the full spectrum of precision circuit fabrication — bringing laser accuracy to processes where mechanical methods fall short. At its core, the series excels at copper ablation: selectively removing copper layers with clean, defined edges and no mechanical stress, enabling fine circuit patterning directly on substrates without masks or chemical etching.

Beyond copper ablation, the same platform handles through-hole drilling, board profiling, and depth-controlled routing — consolidating multiple fabrication steps onto a single machine. Whether working on rigid PCBs, flexible circuits, ceramic substrates, or metal-core boards, the U Series delivers the precision and repeatability that fine-pitch circuit work demands.

A modular laser source architecture makes the series genuinely multi-process: different wavelengths and pulse widths can be configured to suit copper ablation, drilling, cutting, or surface structuring on thermally sensitive or mechanically fragile materials. One platform, selectable laser, broad process coverage — reducing capital investment while expanding production capability.

Paired with CircuitCAM LaserPlus software for intelligent toolpath optimization and one-touch job execution, the U Series offers a practical, scalable path to in-house laser direct structuring — from prototyping through high-volume production.