In surface mount assembly, stencil quality directly determines solder paste deposition accuracy — and ultimately, the reliability of every board produced. The StencilMat Series offers a dedicated laser cutting solution engineered specifically for the production of SMT solder paste stencils, delivering the aperture quality and consistency that modern high-density assembly demands.

Using fiber laser technology, the series cuts stencil apertures with smooth, clean sidewalls and a slightly tapered profile — wider at the bottom than the top — that promotes reliable solder paste release even at fine pitches. Aperture edges are sharp and well-defined, with a micro-surface finish clean enough to require only minimal mechanical polishing or chemical treatment before the stencil is ready for use.

The series spans a range of configurations, from cost-effective entry-level platforms to high-throughput systems capable of exceeding 15,000 apertures per hour — with optional small-aperture acceleration modules pushing speeds to 30,000–80,000 apertures per hour for features in the 30–100 μm range. At the high end of the range, an integrated inline configuration combines laser cutting, marking, polishing, and automated stencil inspection into a single continuous production line, eliminating all post-processing steps and allowing finished stencils to go directly into production.

Suitable for SMT assemblers, PCB fabricators, and professional stencil service providers alike, the StencilMat Series offers a scalable path from in-house stencil self-sufficiency to full-scale stencil manufacturing.