App & Solution
Prepreg laser cutting
Fingerprint module precision cutting/ SIP encapsulation cutting
FR4 PCB depaneling
With the rapid improvement of laser processing efficiency, the FR-4 stamp hole depaneling is rapidly changing into a full-cut. Laser full-cut depaneling is increasingly used in the field of consumer electronics and automotive electronics, and rapidly expanded to epoxy resin-based composite materials including SIP.